ISM 2.0 expands India's government support beyond fabrication to semiconductor equipment, materials, chemicals and advanced packaging.
WHY THIS MATTERS · This matters because China just extended export controls to the equipment that makes gallium and germanium chips while the US locked down sub-14nm tool sales — a two-way choke that is already delaying compound-semiconductor parts for Western defense and power-electronics makers.
Part of the monitored dynamic Global Semiconductor Competition · VUCA INDEX 59/100
"the recently approved India Semiconductor Mission (ISM) 2.0, which expands government support beyond chip fabrication to include semiconductor equipment, materials, chemicals, advanced packaging and supply-chain development"
Extracted by pipeline v0.5 (claude-opus-4-8) from moneycontrol.com · approved by christopher@vucanews.com JUL 23.
Extracted JUL 20; approved JUL 23 at 0.58.
- MOFCOM extended export licensing to gallium and germanium processing equipment
- Infineon opened its €5 billion (~$5.7 billion) Dresden 'smart power fab' Module 4 on July 2, 2026, three months ahead of schedule.
- Infineon's Dresden Module 4 will become its largest facility for power semiconductors, outscaling comparable sites in Asia and the U.S.
- Infineon broke ground on the Dresden 300-mm fab in May 2023, reaching formal opening in July 2026.
- German Chancellor Friedrich Merz addressed the Dresden opening by video, praising the investment enabling cutting-edge semiconductor production in Germany.